FLASH NAND - Radiation Tolerant Memory

FLASH NAND - Radiation Tolerant Memory

APC Technology Group plc

FLASH NAND – Radiation Tolerant Memory

3D PLUS FLASH NAND memories, from APC Hi-Rel, are the highest density memories qualified for space applications. 4Gb to 128Gb radiation tolerant FLASH NAND stacks are available in a variety of temperature ranges, organised x8 and x16, with a power supply of 3.3V.

Based on a very robust SLC NAND FLASH technology, the radiation tolerant FLASH NAND stacks feature endurance of 100K write/erase cycles per sector and 10-years data retention time. The devices are offered with standard SOP footprint for high resistance SMT assembly and for withstanding harsh thermal and mechanical environments.

3D PLUS FLASH NAND products are used for mass data storage in very high density, Non volatile and very low power solid state data recorders.

To discuss your exact requirements contact our technical team on 0330 1244540 or email hi-rel@apcplc.com

FLASH NAND key features:

  • Very high density – smallest footprint (more than 85 % space savings in the design)
  • Non volatile and programmable
  • 100K write/erase cycles capability
  • 10 years data retention
  • Radiation tolerance
  • TID: 60 krads (Si)
  • SEL > 62.5 MeV.cm2/mg
  • SEU: 1.3 MeV-cm2/mg, X-section : 2 E-10cm2/bit
  • Space quality and large flight heritage worldwide
  • No pure tin content guarantee and minimum of 3% lead
  • Very long lifetime electronics (technology proven for 15 to 18 years missions in space)
DensityConfigurationVoltageClock Rate / Access TimePackageTemp*SCD
Density:8GbConfiguration:1G x 8Voltage:3.3VClock Rate / Access Time:25 nsPackage:SOP50Temp*:C, I, MSCD:3DPA-6760:Request datasheet
Density:16GbConfiguration:2G x 8Voltage:3.3VClock Rate / Access Time:25 nsPackage:SOP50Temp*:C, I, MSCD:3DPA-6750:Request datasheet
Density:16GbConfiguration:2G x 8Voltage:3.3VClock Rate / Access Time:25 nsPackage:SOP50Temp*:C, I, MSCD:3DPA-6770:Request datasheet
Density:32GbConfiguration:4G x 8Voltage:3.3VClock Rate / Access Time:25 nsPackage:SOP50Temp*:C, I, MSCD:3DPA-6740:Request datasheet
Density:32GbConfiguration:4G x 8Voltage:3.3VClock Rate / Access Time:25 nsPackage:SOP50Temp*:C, I, MSCD:3DPA-6780:Request datasheet
Density:64GbConfiguration:8G x 8Voltage:3.3VClock Rate / Access Time:25 nsPackage:SOP50Temp*:C, I, MSCD:3DPA-6730:Request datasheet
Density:64GbConfiguration:8G x 8Voltage:3.3VClock Rate / Access Time:25 nsPackage:SOP50Temp*:C, I, MSCD:3DPA-6790:Request datasheet
Density:64GbConfiguration:4G x 16Voltage:3.3VClock Rate / Access Time:25 nsPackage:SOP58Temp*:C, I, MSCD:3DPA-6800:Request datasheet
Density:128GbConfiguration:16G x 8Voltage:3.3VClock Rate / Access Time:25 nsPackage:SOP50Temp*:C, I, MSCD:3DPA-6720:Request datasheet
Temperature Range* C = commercial, I = industrial and M= military temp range

For technical sales and expert advice on our range of high reliability electronic components contact the Hi-Rel team on: