APC Hi-Rel and 3D PLUS present innovative space products at DASIA conference
This year the annual Data Systems in Aerospace event, DASIA, will be held in Oxford from 29-31st May and promises to be packed with high-level speakers and exhibitors centered around hardware and software for space and aircraft systems.
APC Hi-Rel, and our manufacturing partner 3D PLUS, will be exhibiting at this three day event, showcasing the innovative products and solutions dedicated to space applications from 3D PLUS, including its FUSIO RT a new space modular computer core based on European Space FPGA.
The event includes more than 60 keynote speakers and selected high reliability product and component exhibitors. The FUSIO RT will also be the topic of a presentation from Charles Sellier, Electronics Design Manager at 3D PLUS.
APC Hi-Rel has a range of rad tolerant, high temperature components and an extensive heritage of designing in and specifying components and products into space programmes including ExoMars, BepiColombo, EarthCARE and the Galileo ground segment.
Since January 2018, APC Hi-Rel has been the exclusive UK and Ireland representative for 3D PLUS, a world leading supplier of advanced high density 3D microelectronics products for space applications.
For more information about DASIA 2018 visit www.eurospace.org
APC is a member of UK Space SME Forum and our hi-rel products are accredited to the AS9120B.
For more information about our range of rad-tolerant, high reliability components for space applications contact APC Hi-Rel on 0330 124 4540.