APC to showcase space technologies at UK Space Conference 2019
With a thriving UK space industry, this year’s UK Space Conference promises to be an inspiring and innovative event for organisations involved in the space sector. APC Technology Group plc will be there with our technology partner 3D PLUS, promoting our range of space-compatible components and products.
Taking place every two years, this year’s event will be held on 24th to 26th September at ICC Wales with the theme of ‘Inspire. Innovate. Grow’. The event brings together the UK and international space community from across government, industry and academia to exchange ideas, share plans, develop relationships and seek inspiration.
This year, APC and 3D PLUS will be sharing stand D23 where we will be displaying our range of radiation tolerant, space level technologies.
APC Technology Group – Design-in Distributor of Space Level Components
Since 1982, APC Technology Group has been a design-in distributor of specialist electronic components, products and systems for space, aerospace and defence applications and has designed in components and products into space programmes including ExoMars, BepiColombo, EarthCARE and Galileo ground segment.
As a single source supplier for more than twenty best-in-class, global manufactures of space-level components, our space-compatible technologies include amplifiers, cable assemblies, capacitors, connectors, diodes, filters, frequency sources, GaAs FETs, GNSS antennas and accessories, high-performance NTP time servers, memory products, miniaturised cameras, optocouplers, power supplies, PTP network switches and cards. APC can also supply ‘system-in-package’ solutions that miniaturise radiation tolerant systems from our technology partner 3D PLUS.
3D PLUS – World-leading Manufacturer of Microelectronics
Available through APC, 3D PLUS is a manufacturer of advanced high density 3D microelectronic products and dies/wafer stacking technology. 3D PLUS products meet the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics. For more than 20 years, 3D PLUS has been recognised as a high-performance innovator in the design and manufacturing of miniaturised 3D modules.
With a capability of stacking up to 10 semiconductor devices within 1mm, 3D PLUS ultra-low profile modules are unique. 3D PLUS offers a full lineup of radiation-tolerant products including memories, memories IP, POL converters, interfaces, peripherals and protection ICs and more complex System-in-Package. Recognised for their electrical performance, miniaturisation, quality and reliability level, their products are used in all space application fields: telecommunications, navigation, Earth observation, climate monitoring, transportation and sciences.