3D3D4G08WB1473

3D3D4G08WB1473

3D3D4G08WB1473

3D Plus

1.5V, 4Gbit DDR3 SDRAM organised as 512M x8

3D Plus offers a new 4Gbit DDR3 SDRAM cube compatible with the JEDEC standard footprint. Our products are available at 1066, 1333 and 1600 Mbps in Commercial, Industrial and Military temperature range.

Thanks to the high density patented technology the memories are embedded in a small form factor device without compromising electrical or thermal performance. This device is ideal for high density memory applications that require high speed transfer and compatibility with standard servers and networking equipment.

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More Information
Attribute Value
Features
  • 78 balls JEDEC standard ball-out
  • VDD=VDDQ = +1.5V +/-0.075V
  • Differential bidirectional data strobe
  • 8n-bit prefetch architecture
  • 8 internal banks per memory
  • Nominal and dynamic on-die termination
  • Programmable CAS latency
  • Posted CAS additive latency
  • Fixed burst lengths of 8 and burst chp (BC) of 4
  • Selectable BC4 or BL8 on-the-fly
  • Self refresh mode
  • Write leveling
  • Multipurpose register
  • Output driver calibration
  • Clock rate available : 1066, 1333 and 1600 Mbps
  • Commercial, Industrial and Military temperature range
Product Type DDR3 SDRAM
Configuration 512M x8
Package BGA 78
Temperature Range
  • 0°C to +70°C
  • -40°C to +85°C
  • -40°C to +95°C
  • -55°C to +125°C
Power Supply +1.5V ± 0.075V
More Information
Attribute Value
Data Sheet Click here to view

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