3DLV3302VS1619

3DLV3302VS1619

3DLV3302VS1619

3D Plus

4-channel Dual Driver and Receiver LVDS Module, 4 Lines-SOP

The 3DLV3302VS1619 is a Dual CMOS differential line driver and a Dual CMOS differential line receiver, designed for applications requring ultra low power dissipation and high data rates. The device is designed to support data rates up to 400 Mbps (200 MHz) utilising Low Voltage Differential Signalling (LVDS) technology.

The Dual driver accepts LVTTL/LVCMOS input levels and translates them to low voltage (450 mV) differential output signals, and the Dual receiver accepts low voltage (350 mV typical) differential input signals and translates them to 3V CMOS output levels. The 3DLV3302VS1619 provides a new alternative to high power psuedo-ECL devices for high speed point-to-point interface applications.

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More Information
Attribute Value
Features
  • >400 Mbps (200 MHz) switching rates
  • ±450 mV differential signalling
  • 3.3 V power supply
  • Ultra low power dissipation
  • 0.6 ns maximum differential skew (Driver)
  • 4.5 ns maximum propagation delay (Driver)
  • 0.2 ns differential skew -typical (Receiver)
  • 6 ns maximum propogation delay (Receiver)
  • Compatible with IEEE 1596.3 SCI LVDS standard
  • Conforms to ANSI/TIA/EIA-644 LVDS standard
  • Integrated 110Ω Line Termination Resistors
  • Cold spring all I/O pins
  • Radiation Hardened Die
    • TID > 100 Krad (Si)
    • Immune to SEL: LET > 80 MeV.cm²/mg
  • Space Qualified
Product Type LVDS
Pin Assignment N/A
Temperature Range
  • 0°C to +70°C
  • -40°C to +85°C
  • -55°C to +125°C
Power Supply 3.3 V power supply
More Information
Attribute Value
Data Sheet Click here to view

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