APC Locator provides a full sourcing solution including component supply and testing to verify quality, function and authenticity.
Using our certified testing house partner, we can develop a testing plan based on your individual requirements that can include a combination of the below:
Permancency Marking / Blacktopping:
Tests can be undertaken to authenticate the chip top surface and marking. Refurbished electronic components usually have been sanded to remove the original marking, and then covered with a black material to hide the evidence of sanding.
Heated Solvent Test:
This test is an effective method to revealing occurrences of resurfacing. The process includes suspending a sample component in a solution, submerging half of the component. As the component remains in the solution for an extended period of time, any resurfacing or remarking on the submerged end will be removed, while the portion remaining above the surface will remain unaffected.
By utilising optical inspection and visual inspection techniques, it can be confirmed that your recovered components are in good condition. Visual inspection can inspect for damage which may have occurred while they were on the PCBs and in some cases fix these defects.
XRF Testing/XRF Analysis (RoHS Compliant):
XRF analysis facilities provide a non-destructive method to determine which alloy a termination consists of. Once recovered, it is possible to determine which alloy is on the device terminations and convert to a different alloy if desired.
Solderability testing verifies whether or not a component is re-solderable, If this is possible it can be placed onto your PCBs for reflow. Alternatively it is possible to strip the terminations and re-tin to the specified alloy.
Electrical Component Testing (Curve Trace):
The BEST (BGA and Electrical Silicon Test) is an electrical component test used to check the electrical parameters of every pin to pin e.g. current, voltage, diode resistivity, and silicon connectivity. This is a very strong tool which can confirm that the recovered devices are in good working condition.
Key Function Test:
Some devices may need to be tested by creating a circuit to ensure that they are operating as expected. With the aid of the component datasheet, it is possible to create a circuit and an IC Test for your device to check the key aspects of the device. For example, recovered MOSFETs can be tested to confirm that they still meet the manufacturer’s specifications.
Flash Memory Test/ Memory Programming:
Using specialist programming equipment, it is possible to program your components, check for counterfeit programmable components, check device ID codes and confirm whether your devices are blank or already programmed. Previously programmed FLASH parts can be erased back to factory default settings.
De-Cap and Device Non Functionality Analysis:
Your IC can be de-capped and checked for a range of visual indicators to help authenticate the originality of the device. It is also possible to check for IC damage at high optical magnifications and identify the potential cause for test failures.
Ionic contamination testing is required as ionic residues remaining from both the PCB manufacturing and the soldering process may affect the reliability of the finished assembly.
Extreme Temperature Test:
Temperature extremes can significantly alter the mechanical and electrical properties of a component, such as brittleness of ICs, electrical conductivity and frequencies.