3DCM739 - 3DCM734
3DCM739 - 3DCM734
4 Mpx High Resolution Image Sensor, Bayer (RGB) / Monochrome Configuration, Radiation Hardened Design
The space camera module has been designed based on the 3D PLUS technology and includes 4 stacked levels in order to obtain a 3D cube with a reduced volume of 35x35x23 mm3. The top level contains the 2048x2048 pixels CMOS image sensor which is the key element of the camera. Images are provided by the CMOS sensor through the 10 LVDS multiplexable output pairs.
The input supply voltage of the microcamera module can be set from 4.5Vto 9V. Four different voltages (3.3V, 2.5V, 2.1V and 1.5V) are internally generated by four voltage regulators in order to feed the sensor, the oscillator, the FPGA and the memories. Volatile and non-volatile memories are also included and can be used, among other applications, for video data streaming or to load the register state. The FPGAcan store images in the volatile memory placed on the same level and perform preliminary image processing as averaging, adding, windowing etc.
The bottom of the camera contains a PGA array where a rigid-flex pcb can be connected to ensure the link to the system. The PGA array is able to cover a wide range of connections, from LVDS to SpaceWire depending on the FPGA code. As the CMOS sensor is sensitive to Single Event Effects, current limitation capability is integrated in the module in order to be able to switch-off the power supply to the sensor in case of SEL or SET. This instrument has been integrated using the 3D PLUStechnology in orderto be as compact as possible.Particular attention has been paid to ensure a good radiation tolerance to cover a wide range of scientific applications such as planetology, but also platforms or launchers monitoring and star trackers.
|Temperature Range||-40°C / +70°C|
|Product Type||4 Megapixels CMOS Space Camera Head and IPs|
|Memory||2x 512Mb SDRAM and 8Gb NAND Flash|
|Data Sheet||Click here to view|